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Aerosol Jet will enable advanced multi-chip packages for mobile product applications
July 9, 2009
By: DAVID SAVASTANO
Editor, Ink World Magazine
Optomec, Inc. and Vertical Circuits, Inc. (VCI) announced that they are collaborating in the development of a high density 3-dimensional interconnect solution that will enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance Multi-Chip Packages (MCPs). The solution will combine the unique fine feature capabilities of Optomec’s patented Aerosol Jet material deposition system with the cost and functional benefits of VCI’s patented Conformal I...
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